TMC, an international high‑tech consultancy, invites a Senior Process Engineer to join its semiconductor packaging team in the Netherlands. You will develop advanced die attach, assembly, and packaging solutions in a dynamic R&D environment, blending hands‑on experimentation with design and materials expertise.You’ll mentor engineers, collaborate with international customers and partners, and lead DoE studies while guiding process development from concept to realization within a fast‑moving
#J-18808-Ljbffr